1 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 1. product overview 1.1 general description ASF140, 3.3v internally matched if gain block amplifier mmic, has excellent input and output return loss, high linearity , and low noise over a wi de range of frequency dc~1000 mhz , being suitable for use in both receiver and transmitter of telecommunication systems up to 1 ghz. the amplifier is available in a sot343 package and passes through the stringent 100% dc & rf test via an automated test han dler. 1.2 features ? 17.2 db gain at 150 mhz ? 19 dbm p1db at 150 mhz ? 38.5 dbm output ip3 at 150 mhz ? 2.4 db nf at 150 mhz ? mttf > 100 years ? minimum external matching components ? single s upply: +3.3 v 1.3 applications ? base station infrastructure ? repeat er ? telecommunication system 1.4 package profile & rohs compliance ASF140 data sheet 3.3 v if gain block amplifier mmic over dc~1000 mhz sot 343, 2.15x2.0 mm 2 , surface mount rohs - compliant
2 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 2. summary on product performances 2.1 typical performance supply voltage = +3.3 v, t a = +25 ? c, z o = 50 ?? ? parameter typical unit frequency 70 150 300 450 900 mhz gain 17.4 17.2 17.0 16 . 8 15 . 8 db s11 - 1 6.0 - 19.5 - 18.5 - 1 8.0 - 1 4.0 db s22 - 2 0.0 - 2 0.0 - 19.0 - 17.5 - 11.5 db noise figure 2 . 3 2. 4 2. 4 2. 4 2. 5 db output ip3 1) 3 8.0 38 .5 38 .5 36 .0 3 4.0 db m outp ut p1db 19.0 19.0 19.0 19.0 1 5.5 dbm current 86 ma device voltage + 3.3 v 1) oip3 is measured with two tones at the output power of +5 dbm/tone separated by 1 mhz . 2.2 product specification supply voltage = +3.3 v, t a = +25 ? c, z o = 50 ?? ? parameter min typ m ax unit frequency 150 mhz gain 17 . 2 db s11 - 19.5 db s22 - 2 0 db noise figure 2. 4 db output ip3 38 .5 dbm output p1db 19 dbm current 86 ma device voltage + 3.3 v 2.3 pin configuration pin description simplified outline 1 rf_out & bias 2 , 4 ground 3 rf_ in 1 2 3 4
3 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 2.4 absolute maximum ratings parameters max. ratings operation case temperature - 40 to ? 85 ? c storage temperature - 40 to ? 150 ? c device voltage +6 v operation junction temperature +150 ? c input r f power (cw, 50 ? matched) +25 dbm 2.5 thermal resistance symbol description typ unit r th thermal resistance from junction to lead 45 ? c/w 2.6 esd classification & moisture sensitivity level esd clas sification hbm class 1b voltage level: 500 ~ 1000 v mm class a voltage level: <200 v caution: gallium arsenide integrated circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices. moisture sensitivity l evel m sl 3 at 260 ? c reflow (intentionally blanked)
4 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 3. application : 50 ~ 1000 mhz (if, v supply = +3.3 v) 3.1 application circuit & evaluation board bill of material symbol value size description manufacturer a sf140 - - mmic amplifier asb c1, c2 1 n f 0 603 dc block ing capacitor murata c3 100 p f 0 603 bypass capacitor murata c4 1 ? f 0603 decoupling capacitor murata l1 680 n h 0603 rf choke inductor samsung pcb information material fr4 thickness (mm) 0.8 size (mm) 40x40 eb no. eb - 363 - a 4 vdevice = +3.3 v rf out rf in ASF140 l1 c4 c3 c2 c1
5 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 3.2 performance table supply voltage = +3.3 v, t a = +25 ? c, z o = 50 ?? ? parameter typical unit frequen cy 70 150 300 450 900 mhz gain 17.4 17.2 17.0 16 . 8 15 . 8 db s11 - 1 6.0 - 19.5 - 18.5 - 1 8.0 - 1 4.0 db s22 - 2 0.0 - 2 0.0 - 19.0 - 17.5 - 11.5 db noise figure 2 . 3 2. 4 2. 4 2. 4 2. 5 db output ip3 1) 3 8.0 38 .5 38 .5 36 .0 3 4.0 dbm output p1db 19.0 19.0 19.0 19.0 1 5.5 d bm current 86 ma device voltage + 3.3 v 1) oip3 is measured with two tones at the output power of +5 dbm/tone separated by 1 mhz . 3.3 plot of s - parameter & stability factor 0 200 400 600 800 1000 frequency (mhz) -60 -50 -40 -30 -20 -10 0 10 20 30 40 s-parameters (db) 0 1 2 3 4 5 6 7 8 9 10 stability factor, k s21 s12 s11 s22 k
6 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 3.4 plots of noise figure, aclr (for lte) and performances with temperature note that aclr test conditions are as follows; 1) test source: lte_fdd_test model 3.1, bw: 10 mhz & 20 mhz, test frequency: 140 mhz 2) test source: lte_fdd_test model 3.1, bw: 20 mhz, test frequency: 140 mhz 0 200 400 600 800 1000 frequency (mhz) 0 1 2 3 4 5 nf (db) nf 0 2 4 6 8 10 12 output power (dbm) -70 -65 -60 -55 -50 -45 -40 aclr (dbc) 20 mhz bw 10 mhz bw 0 200 400 600 800 1000 frequency (mhz) 0 5 10 15 20 gain (db) -40 c +25 c +85 c 0 200 400 600 800 1000 frequency (mhz) -30 -20 -10 0 s11 (db) -40 c +25 c +85 c
7 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 0 200 400 600 800 1000 frequency (mhz) -30 -20 -10 0 s22 (db) -40 c +25 c +85 c -60 -40 -20 0 20 40 60 80 100 temperature (c) 70 75 80 85 90 95 current (ma) -60 -40 -20 0 20 40 60 80 100 temperature (c) 0 5 10 15 20 25 gain (db) frequency = 150 mhz -60 -40 -20 0 20 40 60 80 100 temperature (c) 0 1 2 3 4 5 nf (db) frequency = 150 mhz 2 4 6 8 10 12 14 16 output tone power (dbm) 0 10 20 30 40 50 output ip3 (dbm) -40 c +25 c +85 c frequency = 150 mhz -60 -40 -20 0 20 40 60 80 100 temperature (c) 14 16 18 20 22 p1db (dbm) frequency = 150 mhz
8 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 4. package outline (sot343, 2.15x2.0x1.0 mm) 5. surface mount recommendation (in mm) symbols dimensions (in mm) min max a 0.90 1.10 a1 0.025 0.10 a2 0.875 1.00 b 0.20 0.40 b1 0.50 0.70 c 0.10 0.15 d 1.90 2.10 e 1.15 1.35 e1 2.00 2.30 e 0.65bsc e 1 1.30bsc e2 0.15bsc l 0.425ref l1 0.300ref l2 0.200ref n ote 1. the number and size of ground via holes in a circuit board are crit ical for thermal and rf grounding considerations. 2. r ecommend is that the ground via holes be placed on the bottom of the ground lead s and exposed pad of the device for better rf and thermal performance, as shown in the drawing at the left side. 0.42 1.48 1.23 0.30 0.50 0.50 0.25 1.85 0.30 1.33 0.40 0.30
9 / 9 asb inc. ? sales@asb .co.kr july 20 14 a sf140 6. recommended soldering reflow profile (end of datasheet) 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec)
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